In-Mold Electronics

In-mold electronics (IME) incorporates printed electronic elements, such as conductive traces, dielectric layers, and integrated circuits, as well as graphic layers onto a flat thermoplastic substrate. This substrate is then thermoformed into a 3D shape to create what’s known as an “inlay.” The formed inlay is placed into an injection mold (hence the term “in-mold”).

Molten plastic is then injected behind the inlay, permanently bonding with it and encapsulating the electronics. The result is a single, rigid, and lightweight 3D plastic part with fully integrated, functional electronics, such as electrodes, lighting elements, antennas, or sensors, alongside decorative surfaces.